During the ICT WEEK Uzbekistan 2026 event, a meeting took place between Dildora Nasibulayeva, Head of International Relations at IT Park Uzbekistan, and Ankit Sethi, Senior Manager for Regional Partnership and Channel Development in the Middle East at Hong Kong Science and Technology Park (HKSTP).
The parties discussed the further development of cooperation in the fields of startups, artificial intelligence, as well as research and development. IT Park Uzbekistan noted that the meeting covered support for technology companies entering new markets, strengthening ties between startup ecosystems, and prospects for joint work in AI and R&D.
Special attention was paid to the participation of four HKSTP startups in ICT WEEK Uzbekistan 2026. During their visit, representatives of these companies already held meetings with Uzinfocom, Uztelecom, and TUIT. The parties discussed opportunities for providing additional support and assistance to these companies when entering the Uzbek market.
Participants also considered the possibility of organizing trips for Uzbek startups to Hong Kong. Such visits would allow companies to familiarize themselves with HKSTP's technological infrastructure, establish contacts with local firms, and exchange experiences with members of the Hong Kong startup ecosystem.
Cooperation between IT Park Uzbekistan and HKSTP is developing steadily. In July 2026, the parties signed a memorandum of understanding. A specialized webinar for HKSTP companies and startups on the opportunities for entering the Uzbek market was held in August. Cooperation continued in September when a delegation from IT Park Uzbekistan visited Hong Kong to participate in the Belt and Road Summit 2026.
HKSTP is one of Hong Kong's key innovation platforms, focusing on deep technologies and research and development. The park's ecosystem brings together over 2,400 technology companies from 26 countries and more than 17,000 R&D specialists. HKSTP's priority areas include robotics, biotechnology, fintech, smart city solutions, advanced manufacturing, and artificial intelligence.